Oriental Fast Assembly Limited
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Contact Us
  • Contact Person : Mr. Lu Xavier
  • Company Name : Oriental Fast Assembly Limited
  • Tel : 86-755-83120594,83120364,83120367
  • Fax : 86-755-83124293
  • Address : Guangdong,Shenzhen,4/f, 2nd Building, Fuguo Industrial Park, No.28, Kaifeng Road,Meilin, Futian District, Shenzhen City, Guangdong Province. China
  • Country/Region : China
  • Zip : 518049

PCB product

PCB product
Product Detailed
Related Categories:Multilayer PCB

Detailed Product Description


Oriental Fast Assembly Ltd is specializes in producing the various electronic products based on your designs and assemble pcb for all kinds of sample, small and medium volume. The product field includes but are not limited to:

Industrial control

Alarm products

Measurement device

Telecom audio and video

Consumer electronics

Enabling you to focus on products development and sales, we can solve your production technology issues and take care of products quality.

The operation we can handle for you is from the bare board fabrication, full component procurement, SMT/BGA/DIP assembly, inspection of finished goods to shipment arrangement.

1.2 automated manufacturing SMT lines(All of them support the chips up to 0402, and support micro-BGA and IC, Rohs products).

2. 1 Wave Soldering Line, supporting Rohs products.

3. 2 Hand Manual Soldering Lines for DIP, supporting Rohs products.

4. SMD capacity is 500,000chips/day with two shifts.

Our assembly competence:

Stencil size/range: 736*736mm

Minimum IC pitch:0.30mm

Maximum PCBA size: 410*360mm

Minimum PCB thickness:0.40mm

Minimum chip size:0201

Maximum BGA size:74*74mm

BGA ball pitch: 1.00mm(min), 3.00mm(max)

BGA ball diameter:0.4mm(min), 1.0mm(max)

QFP lead pitch: 0.38mm(min), 2.54mm(max)

Frequency of stencil cleaning: 1 time/5 to 10 pieces

Capability for PCB:

1.      Layer: 1,2, multilayer to 30 layers

2.      Board finished thickness:0.40mm-7.00mm

3.      Material: FR-4,CEM-1,FR-1,FR-2

4.      Max. finished board size:610mm*1100mm

5.      Min. drilled hole size: 0.10mm

6.      Min. line width:0.10mm(batch) 0.075mm(sample and small batch)

7.      Min. line spacing:0.10mm(batch) 0.075mm(sample and small batch)

8.      Surface finish/treatment: HASL/HASL lead free, Immersion Sliver/Gold, OSP, Gold plating;

9.      Copper thickness:35um-210um(outer);17um-210um(inter)

10. Solder mask color: green/yellow/blue/black/white/red

11. Inner packing: Vacuum packing/Plastic bag

Outer packing: Standard carton packing

12. Hole tolerance: PTH: 0.076  NPTH: 0.05

13. Certification: UL, ISO 9001, ISO 14000, RoHS



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